Common PCB Builds
Explanatory graphics of most common and useful ways to construct PCB’s are listed below. There are other ways but the ones listed are industrially sound and commonly used. A useful framework based on years of industrial experience of methods that are tested and proven to work. If you want more information about a specific build please send us an email!
Routing constraints in a layout can easily be solved by increasing build complexity, like adding another layer or blind and buried vias. The pcb cost can increase rapidly using complex builds with more layers, maybe buried and blind vias, laser vias, flexible pcb, flex-rigid etc., and also mean longer lead times and fewer able suppliers, but most of the options are below. Builds must also be symmetric or no serious supplier can manufacture boards without warp. Symmetric build means new layers added symmetrically at both sides at same stage, thicknesses of added layers near same, copper planes near same thickness and close to same overall areas, and placed symmetrically. Most build examples are shown as 4 or 6 layers yet number of layers is usually not a limitation. Finally don’t forget that the “art” in pcb layout is to fit complex circuitry into simple builds. The graphics on this page are totally free to copy for private, educational or commercial purposes! Right-click – “copy image” – and paste in email or anywhere. Image size can typically be adjusted after pasting.
The Shipco R700xx -numbers provides references to these builds and the references can typically be found via net searches. This could be the only existing systematic public reference library of pcb builds; you may be among the first to use it, please let us have your comments!
R7000 – Single sided
R7001 – Double sided – no plated holes (NPTH)
R7002 – Double sided with plated holes (PTH)
R7003 – 4 Layer standard multilayer
R7004 – 4 Layer with buried vias L2-L3
R7005 – 4 Layer with drilled blind vias L1-L2 & L3-L4
R7006 – 6 Layer with buried vias L3-L4 and drilled blind vias L1-L2 & L5-L6
R7007 – 6 Layer with 2 buried via layers L2-L3 & L4-L5
R7008 – 8 layer, 2 buried via layers 3-4 & 5-6 and blind vias L1-L2 & L7-L8
R7009 – 4 Layer with laser vias one side, L1-L2
R7010 – 4 Layer with laser vias 2 side, L1-L2 & L3-L4
R7011 – 4 Layer with buried vias L2-L3 & laser vias L1-L2 & L3-L4
R7012 – Two buried and two micro-via layers One lamination stage
R7013 – 2 + 2 Micro-via layers Two lamination stages
R7014 – 2 + 2 Micro-via stacked design Two lamination stages
R7015 – Buried (<0,8mm) 2 + 2 Micro-via with no via fill) Two lamination stages
R7016 – Buried via (> 0,8mm require via fill) 2 + 2 micro-via Two lamination stages
R7017 – One buried 2 + 2micro-via (via in via version) Two lamination stages
R7018 – Two buried and 2 + 2 micro-via Two lamination stages
R7019 – Filled and flat over plated vias. One lamination stage
R7020 – Via in via and copper filled micro vias. Two lamination stages
R7021 – Single sided no plated and double sided Through plated Flex board
R7022 – 2 layers Rigid Flex board One lamination stage
R7023 – 3 layers asymmetric Rigid Flex Board One lamination stage
R7024 – 4 layers Rigid Flex board One lamination stage
PCB Technical Recources by Shipco Circuits Inc. is licensed under a Creative Commons Attribution-ShareAlike 3.0 Unported License.