Embedded active Components

Also active components can be built directly into PCB´s !
A lot of investigation and experiments have been done with this type of embedding.
The  simplest version is a SMT chip embedded in a multilayer, similar as in figures below. The connections to the chip is then made by means of through holes  through standard SMT leads, or laser vias to the component leads. The component connection is then made chemically, followed by electroplating  which means solder free assembly.

Lower capacitances  due to shorter routing when dies are used and possibility to shield sensitive circuits totally are among the advantages.  Well tested and in-circuit fully protected components must be used for natural reasons.   Several patents have been granted  on the technology but  most of the technology is free to be used. You are  welcome to ask us questions as we started testing the technology and embedded SMT chips in PCBs already 2002.

Here below are build samples  and micro sections from  production done in Ireland.

Flip chip connected to micro-vias
Flip chip connected to staggered micro-vias

 

 

 

 

 

 

 

Both flip chip and other component built in
Micro section from produced Board

 

 

 

 

 

 

Trough Hole Connections

 

 

 

 

 

 

 

 

 

Trough Hole Connection with blind Hole Cooling