Micro-via advantages in multilayer pcbs

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  • Shorter trace lengths
  • Fewer signal layers – due to shorter trace lengths
  • Enhanced RF-capability – due to same
  • Improved EMC-characteristics – due to same
  • More room for components – often two sided assembly can be avoided
  • Much more room for components with R7011 build
  • Smaller pcb for same functions possible
  • Micro via technology have better reliability than through holes
  • Integration of screen resistors resistors on layers 2 and n-1 is feasible
  • Reduction of  drilled through-holes
  • Environmentally friendly
Reliability testing for microvias in printed wire boards PDF
BGA Contacts 64_Pitch 0,8_Pad 0,3_Line/Space 0,15_Vias 0,3_Microvias 0,1 mm
BGA Contacts 64_Pitch 0,8_Pad 0,3_Line/Space 0,15_Vias 0,3_Microvias 0,1 mm

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Microvia
UV-Jag laser drilled in RCC-folie 0,1mm and stepped 0,2 to 0,1 mm